Atomic Layer Deposition
Atomic Layer Deposition (ALD) is a thin film deposition technique that allows for precise control of film thickness and composition at the atomic scale. ALD is a cyclic process that involves the sequential exposure of a substrate to alternating precursor gases, resulting in the deposition of a single atomic layer per cycle. The process is self-limiting, meaning that the deposition stops once a monolayer is formed. ALD is widely used in the fabrication of microelectronics, energy storage devices, and advanced coatings for aerospace applications. The ability to deposit conformal, uniform, and pinhole-free films with precise thickness control makes ALD a valuable tool for the development of next-generation materials and devices.
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